WAFER CHUCK PULL-OUT FEATURE:

ALLOWING CONVENIENTAND SAFE WAFER EXCHANGE WITH 12 INCHES OF UNOBSTRUCTED ACCESS. INCLUDING A ERGONOMIC HANDLE DESIGN WITH REPEATABLE MECHANICAL TRIGGER RELEASE/LOCK AND A HEAVY DUTY PRECISION BEARING GUIDE SYSTEM.

PLATEN TWO POSITION FAST Z ,GAS SHOCK ASSISTED

MECHANICAL PLATEN LIFT SYSTEM:

MICROSCOPE LIFT DELAY WITH ADJUSTABLE OFFSET. AVOIDING MICROSCOPE OBJECTIVE INTERFERENCE WITH PROBE CARDS AND PROBES DURING THELOADING AND UNLOADING Of WAFERS.

PLATEN COOLING

AIR COOLED TO REDUCE PROBE DRIFT CAUSED BY HIGH TEMPERATURE TESTING

INTEGRATED VIBRATION ISOLATION TABLE

PLATFORM WITH ADJUSTABLE CASTERS AND JOY STICK

INTELLIGENT MOTOR

310mm X-Y STAGE DRIVE WITH SUB MICRON RESOLUTION.




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